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RL5E826A Features:
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| The RL5E826ACM3250 is a complete front-end advanced set-top box solution providing dual 256-QAM receivers, an out-of-band QPSK receiver and a QPSK/16-QAM upstream burst modulator. All major physical layer standards are supported allowing set-tops based on the RL5E826A design to be deployed worldwide. The device includes a complete DOCSIS/EuroDOCSIS 1.1 MAC (including QoS) and DAVIC 1.2/1.5 MAC for broadband interactive services. |
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RL5E826A (Absolute) Maximum Ratings:
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| Video Processing l High quality video output of still pictures (704x480 or 704x576) with only 4M DRAM l Provides vertical scaling which allows full screen display of 240 (480)-line sources on PAL systems l Provides filters to enhance image quality for SIF format data on full screen display l User-programmable fade-in, fade-out effects and adjustable brightness l 8-bit YCbCr video output |
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RL5E826A Pinout:
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| Copyright © 1995, VIA Technologies Incorporated. Printed in Taiwan. ALL RIGHTS RESERVED. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written permission of VIA Technologies Incorporated. The VT86C100P may only be used to identify products of VIA Technologies. All trademarks are the properties of their respective owners. |
| Note 1: Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The table of electrical characteristics provide conditions for actual device operation. Note 2: Unless otherwise specified, all voltage are referenced to ground. |
| State-of-the-Art EPIC-B™ BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25C High-Drive Outputs (C32-mA IOH, 64-mA IOL) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package |
